摘要：MacDermid MID Copper and supporting processes specifically designed for molded interconnect device applications. Designed to deliver 麦德美MID沉铜及后续的沉镍、沉金化学镀产品广泛应用于手机外壳、电子线路的金属化中。

关键词：电子线路 mid 电镀 部件 塑模 

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